SK Group Warns AI Memory Fight Is Turning Geopolitical
SK Group Chairman Chey Tae-won says customers want 60-100% more AI memory in 2027 than in 2026, and warns governments are starting to treat chip access as a matter of economic security.
Articles Tagged "HBM3e"
SK Hynix Nasdaq IPO: $28B HBM Bet Prices Thursday
SK Hynix's $28B Nasdaq IPO prices Thursday, putting the dominant supplier of AI high-bandwidth memory in reach of US investors for the first time.
South Korea Commits $518B to Samsung and SK Hynix Fabs
South Korea announced an 800 trillion won chip investment plan to build four new fabs with Samsung and SK Hynix in the country's southwest, targeting AI memory dominance through 2035.
Anthropic Locks In Micron as HBM Defines the AI Race
Micron and Anthropic signed a multi-year HBM supply deal on June 22, with Micron also investing in Anthropic's Series H as memory bandwidth becomes the rate-limiting constraint for frontier AI.
AMD Instinct MI350P - CDNA 4 PCIe Inference Card
AMD Instinct MI350P brings CDNA 4 to a standard PCIe slot: 144GB HBM3E, 4 TB/s bandwidth, 2.3 PFLOPS MXFP8, and 600W passive cooling for air-cooled servers.
Google TPU 8i - Low-Latency Inference for Agent Era
Google's TPU 8i is a purpose-built inference chip with 10.1 FP4 PFLOPs, 288GB HBM3e at 8,601 GB/s, and a Boardfly topology that cuts collective latency 5x for agentic AI workloads.
Google TPU 8t - AI Training at ExaFLOP Scale
Google's TPU 8t packs 12.6 FP4 PFLOPs and 216GB HBM3e per chip, scaling to 9,600-chip superpods with 121 ExaFLOPS and 2 petabytes of shared HBM for massive model training.
Rebellions RebelRack - 64 FP8 PFLOPs at 5 Kilowatts
The Rebellions RebelRack packs 32 Rebel100 chiplet NPUs with 4.5TB HBM3E and 153.6 TB/s aggregate bandwidth into a rack drawing just 5kW - roughly 4x the compute-per-watt of an H100 DGX.
AMD Instinct MI325X - 256GB CDNA3 for Inference
AMD Instinct MI325X specs, benchmarks, and analysis. 256GB HBM3e at 6 TB/s, 2.6 PFLOPS FP8, CDNA3 architecture - the memory-capacity upgrade to the MI300X targeting large model inference.
Huawei Atlas 350 - China's FP4 Inference Accelerator
Huawei Atlas 350 specs, benchmarks, and analysis. Ascend 950PR chip, 112GB HiBL 1.0 HBM, 1.56 PFLOPS FP4, 600W - China's first domestically developed FP4-capable AI accelerator.
Microsoft Maia 200 - Azure's Inference Accelerator
Microsoft Maia 200 specs, benchmarks, and architecture analysis. TSMC 3nm, 216GB HBM3e, 10 PFLOPS FP4, 750W - Microsoft's first inference-only silicon deployed in Azure.
AMD Instinct MI455X
AMD's flagship CDNA 4 AI GPU with 432 GB HBM4, 40 PFLOPS FP4, and 2nm chiplet design targeting H2 2026.
