
AMD Instinct MI450 - 2nm, 432 GB HBM4, 40 PFLOPS
AMD's CDNA 5 accelerator on TSMC 2nm with 432 GB HBM4 memory - the GPU behind OpenAI's 1GW deployment and Oracle's 50,000-chip supercluster.
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AMD's CDNA 5 accelerator on TSMC 2nm with 432 GB HBM4 memory - the GPU behind OpenAI's 1GW deployment and Oracle's 50,000-chip supercluster.

AMD Instinct MI350P brings CDNA 4 to a standard PCIe slot: 144GB HBM3E, 4 TB/s bandwidth, 2.3 PFLOPS MXFP8, and 600W passive cooling for air-cooled servers.

AMD Helios packs 72 Instinct MI455X GPUs and 31 TB HBM4 into a single rack delivering 2.9 FP4 ExaFLOPS for AI workloads.

Zyphra's ZAYA1-8B matches Claude 4.5 Sonnet on HMMT 2025 math benchmarks at just 760M active parameters, trained entirely on AMD Instinct MI300X GPUs under Apache 2.0.

Zyphra's ZAYA1-8B is an 8.4B-parameter MoE reasoning model with only 760M active parameters that matches DeepSeek-R1-0528 on math and coding benchmarks while running at a fraction of the compute cost.

Six companies just released MRC, an open networking protocol that routes AI training traffic across hundreds of simultaneous paths to end GPU idle time at supercomputer scale.

The AMD Instinct MI430X is AMD's CDNA 5 HPC accelerator with 432GB HBM4, full FP64 support, and 19.6 TB/s bandwidth - designed for sovereign AI and scientific supercomputing alongside the MI455X AI GPU.

AMD Instinct MI325X specs, benchmarks, and analysis. 256GB HBM3e at 6 TB/s, 2.6 PFLOPS FP8, CDNA3 architecture - the memory-capacity upgrade to the MI300X targeting large model inference.

AMD's flagship CDNA 4 AI GPU with 432 GB HBM4, 40 PFLOPS FP4, and 2nm chiplet design targeting H2 2026.

AMD expands its Ryzen AI Embedded P100 family with six new 8-to-12-core processors delivering 80 system TOPS, targeting industrial automation, robotics, and medical imaging.

Meta and AMD signed a 6-gigawatt, multi-year GPU pact worth up to $100B - announced days after a separate Nvidia expansion, signaling Meta's deliberate strategy to break single-vendor dependence in AI compute.

Ayar Labs closes a $500M Series E backed by Nvidia, AMD, and Sequoia to mass-produce co-packaged optical interconnects that replace copper in AI data centers.