SambaNova SN50 RDU - Agentic Inference Chip
Complete specs and analysis of SambaNova's SN50 RDU - a TSMC 3nm dataflow chip with 3.2 PFLOPS FP8, three-tier memory, and claimed 5x speed over NVIDIA B200.
Hardware Articles
AMD Instinct MI300X
AMD Instinct MI300X specs, benchmarks, and real-world performance data. 192GB HBM3, 5,300 GB/s bandwidth, 2,610 TFLOPS FP8 on CDNA 3 chiplet architecture.
AMD Instinct MI350X
AMD Instinct MI350X specs and performance estimates. 288GB HBM3e, ~6,000 GB/s bandwidth, ~3,600 TFLOPS FP8 on CDNA 4 architecture at TSMC 3nm.
Apple M4 Max - Unified Memory for Large Models
Full specs and benchmarks for the Apple M4 Max SoC - up to 128GB unified memory at 546 GB/s, 3nm process, and why it has become the quiet favorite for running 70B+ models locally.
AWS Trainium2 - Amazon's Cloud Training Chip
AWS Trainium2 is Amazon's second-generation custom AI training chip, powering EC2 Trn2 instances with 96GB HBM2e per chip and tight integration with the AWS Neuron SDK and SageMaker ecosystem.
Cambricon MLU590 - China's Inference Accelerator
Full specs and analysis of the Cambricon MLU590 - 192GB HBM2e, ~2,400 GB/s bandwidth, TSMC 7nm, and what it means for AI inference outside the NVIDIA ecosystem.
Google TPU v6e Trillium
Google Cloud TPU v6e Trillium specs, benchmarks, and pricing. 32GB HBM per chip, ~1,600 GB/s bandwidth, optimized for Transformer training and inference at cloud scale.
Google TPU v7 Ironwood
Google TPU v7 Ironwood specs, architecture, and performance estimates. Google's next-gen inference-optimized TPU with massive memory per chip, announced at Cloud Next 2025.
Groq LPU - Deterministic Inference at Scale
Groq's Language Processing Unit (LPU) is a purpose-built inference ASIC that trades HBM for 230MB of on-chip SRAM, delivering deterministic latency and record-breaking tokens-per-second for LLM serving.
Huawei Ascend 910B
Huawei Ascend 910B specs, benchmarks, and real-world performance. 64GB HBM2e, ~1,200 GB/s bandwidth, ~600 TFLOPS FP16 - the chip that trained DeepSeek.
Huawei Ascend 910C
Huawei Ascend 910C specs, benchmarks, and performance analysis. 96GB HBM2e, ~1,800 GB/s bandwidth, ~800 TFLOPS FP16 - China's flagship AI chip under US sanctions.
Intel Gaudi 3 - Challenging NVIDIA on Price
Intel Gaudi 3 is a TSMC 5nm AI accelerator with 128GB HBM2e and 1,835 TFLOPS FP8 performance, positioned as a cost-effective alternative to NVIDIA H100 for training and inference workloads.
